JPH0217485Y2 - - Google Patents
Info
- Publication number
- JPH0217485Y2 JPH0217485Y2 JP1981113879U JP11387981U JPH0217485Y2 JP H0217485 Y2 JPH0217485 Y2 JP H0217485Y2 JP 1981113879 U JP1981113879 U JP 1981113879U JP 11387981 U JP11387981 U JP 11387981U JP H0217485 Y2 JPH0217485 Y2 JP H0217485Y2
- Authority
- JP
- Japan
- Prior art keywords
- screw
- hole
- printed board
- housing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229940125773 compound 10 Drugs 0.000 description 2
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113879U JPS5820540U (ja) | 1981-07-31 | 1981-07-31 | Ｉｃ放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113879U JPS5820540U (ja) | 1981-07-31 | 1981-07-31 | Ｉｃ放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5820540U JPS5820540U (ja) | 1983-02-08 |
| JPH0217485Y2 true JPH0217485Y2 (en]) | 1990-05-16 |
Family
ID=29908167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981113879U Granted JPS5820540U (ja) | 1981-07-31 | 1981-07-31 | Ｉｃ放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5820540U (en]) |
-
1981
- 1981-07-31 JP JP1981113879U patent/JPS5820540U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5820540U (ja) | 1983-02-08 |
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